M24C32-R datasheet(33/42 Pages) STMICROELECTRONICS

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M24C32-W M24C32-R M24C32-F M24C32-X M24C32-DF

Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

For die information concerning the M24C32 delivered in unsawn wafer, please contact your

nearest ST Sales Office.

Figure 15. UFDFPN5 (MLP5) – package outline (UFDFPN: Ultra thin Fine pitch

Dual Flat Package, No lead)

1. On the bottom side, pin 1 is identified by the specific pad shape and, on the top side, pin 1 is defined from

the orientation of the marking: when reading the marking, pin 1 is below the upper left package corner.

Table 20. UFDFPN5 (MLP5) – package dimensions (UFDFPN: Ultra thin Fine pitch

Dual Flat Package, No lead)

Symbol

millimeters

inches(1)

1. Values in inches are converted from mm and rounded to four decimal digits.

Typ

Min

Max

Typ

Min

Max

0.550

0.500

0.600

0.0217

0.0197

0.0236

–

0.050

–

0.0020

0.220

0.180

0.260

0.0087

0.0071

0.0102

1.700

1.600

1.800

0.0669

0.0630

0.0709

1.500

1.400

1.600

0.0591

0.0551

0.0630

1.400

1.300

1.500

0.0551

0.0512

0.0591

0.220

0.180

0.260

0.0087

0.0071

0.0102

0.400

–

0.0157

–

0.550

0.500

0.600

0.0217

0.0197

0.0236

0.400

–

0.0157

–

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