Soldering and Mounting

1. Mounting Hole

Mounting holes should be designed as specified below.

DSN6

DSS6

VFR3V

VFS6V

DSS1

DSN9

DSN9H

DST9

DST9H

VFS9V

Part Number

Bulk Type (in mm)

Taping Type (in mm)

2.5±0.2

2.5±0.2

ø0.8-3

ø1.0-3

ø0.8-3

ø0.8-3

2.5±0.2

2.5±0.2

2.5±0.2

2.5±0.2

2.5±0.2

2.5±0.2

2.5±0.2

2.5±0.2

ø0.8-3

(1) Use Sn-3.0Ag-0.5Cu solder.

(2) Use Rosin-based flux. Do not use strong acidic flux with

halide content exceeding 0.2wt% (chlorine conversion

value).

(3) Products and the leads should not be subjected to any

mechanical stress during the soldering process, or while

subjected to the equivalent high temperatures.

(4) Standard flow soldering profile.

2. Soldering

Solder

Soldering Temperature Soldering Time

Sn-3.0Ag-0.5Cu solder

250 to 260°C

4 to 6s

Pre-heating

Soldering

Gradual cooling

(in air)

150°C

300

250

200

150

100

50

60s min.

Soldering time

Soldering temperature

VFC2H

5.2±0.4

ø0.8-2

5.2±0.4

ø1.0-2

Continued on the following page.

33

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.