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80960HA Datasheet(PDF) 30 Page - Intel Corporation

No. de pieza 80960HA
Descripción Electrónicos  80960HA/HD/HT 32-Bit High-Performance Superscalar Processor
PDF  102 Pages
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Fabricante Electrónico  INTEL [Intel Corporation]
Página de inicio  http://www.intel.com
Logo INTEL - Intel Corporation

80960HA Datasheet(HTML) 30 Page - Intel Corporation

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80960HA/HD/HT
24
Advance Information Datasheet
Table 12. Maximum TA at Various Airflows in °C (PGA Package Only)
Airflow-ft/min (m/sec)
fCLKIN
(MHz)
0
(0)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
1000
(5.07)
Core
1X Bus
Clock
TA with
Heatsink*
25
33
40
69
63
59
74
70
67
78
75
73
79
77
75
80
79
77
80
79
77
TA
without
Heatsink
25
33
40
64
56
50
67
62
56
71
67
63
74
70
67
75
72
69
76
74
71
Core
2X Bus
Clock
TA with
Heatsink*
16
25
33
40
68
58
49
41
73
66
60
55
77
73
69
65
79
75
71
68
80
77
74
72
80
77
74
72
TA
without
Heatsink
16
25
33
40
62
49
38
27
66
56
46
38
71
62
55
48
73
66
60
55
75
68
63
58
76
71
66
62
Core
3X Bus
Clock
TA with
Heatsink*
20
25
53
45
63
58
71
67
73
70
76
73
76
73
TA
without
Heatsink
20
25
43
33
51
42
58
51
63
58
66
61
68
64
*0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
Table 13. 80960Hx 168-Pin PGA Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
(0)
200
(1.01)
400
(2.03)
600
(3.07)
800
(4.06)
1000
(5.07)
θ Junction-to-Case
(Case measured as
shown in Figure 5)
1.51.5
1.51.5
1.51.5
θ Case-to-Ambient
(No Heatsink)
17
14
11
9
8
7
θ Case-to-Ambient
(With Heatsink)*
13
965
44
NOTES:
1. This table applies to 80960Hx PGA plugged into socket or soldered directly to board.
2.
θ
JA = θJC + θCA
*0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
θ
JC
θ
JA



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