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80960KA Datasheet(PDF) 33 Page - Intel Corporation |
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80960KA Datasheet(HTML) 33 Page - Intel Corporation |
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33 / 43 page ![]() 80960KA 30 Figure 22. HOLD Timing Table 14. 80960KA PQFP Package Thermal Characteristics Thermal Resistance — °C/Watt Parameter Airflow — ft./min (m/sec) 0 (0) 50 (0.25) 100 (0.50) 200 (1.01) 400 (2.03) 600 (3.04) 800 (4.06) θ Junction-to-Case 9 9 9 9 9 9 9 θ Case-to-Ambient (No Heatsink) 22 19 18 16 11 9 8 NOTES: 1. This table applies to 80960KA PQFP soldered directly to board. 2. θ JA = θJC + θCA 3. θ JL = 18°C/W (approx.) θ JB = 18°C/W (approx.) θ JC θ JL θ JB Th Th Th CLK2 CLK HOLD HLDA T12 T11 T6H T9H |
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