80960SA datasheet(25/39 Pages) INTEL

25 / 39 page

80960SA

3.0

MECHANICAL DATA

3.1

Packaging

The 80960SA is available in two package types:

•

80-lead quad flat pack (EIAJ QFP). Shown in

Figure 15.

•

84-lead plastic leaded chip carrier (PLCC).

Shown in Figure 16.

Dimensions for both package types are given in the

Intel Packaging handbook (Order #240800).

3.2

Pin Assignment

The QFP and PLCC have different pin assignments.

The QFP pins are numbered in order from 1 to 80

around the package perimeter. The PLCC pins are

numbered in order from 1 to 84 around the package

perimeter. Tables 9 and 10 list the function of each

QFP pin; Tables 11 and 12 list the function of each

PLCC pin.

VCC and GND connections must be made to multiple

VCC and GND pins. Each VCC and GND pin must be

connected to the appropriate voltage or ground and

externally strapped close to the package. It is recom-

mended that you include separate power and ground

planes in your circuit board for power distribution.

Pins identified as NC (No Connect) should never be

connected.

Figure 15. 80-Lead EIAJ Quad Flat Pack (QFP) Package

AD1

AD2

VSS

AD3

AD4

AD5

AD6

VSS

A23

A24

A25

VCC

VSS

VCC

ALE

READY

BE1

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41

9 10 11 12 13 14 15 16 17 18 19 20 21

22 23 24

A26

A27

A28

A29

A30

A31

S80960SA-20

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80960SA Datasheet(PDF) 25 Page - Intel Corporation

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