µPC2800A

10

7. RECOMMENDED SOLDERING CONDITIONS

Solder this product under the following recommended conditions.

For details of the recommended soldering conditions, refer to information document Semiconductor Device

Mounting Technology Manual (C10535E).

For soldering methods and conditions other than those recommended, consult NEC.

Surface Mount Type

µPC2800AGR: 8-pin plastic SOP (225 mil)

Process

Conditions

Symbol

Infrared ray reflow

Peak temperature: 230

°C or below (Package surface temperature),

IR30-00-1

Reflow time: 30 seconds or less (at 210

°C or higher),

Maximum number of reflow processes: 1 time.

VPS

Peak temperature: 215

°C or below (Package surafce temperature),

VP15-00-1

Reflow time: 40 seconds or less (at 200

°C or higher),

Maximum number of reflow processes: 1 time.

Wave soldering

Solder temperature: 260

°C or below, Flow time: 10 seconds or less,

WS60-00-1

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120

°C or below (Package surface temperature).

Partial heating method

Pin temperature: 300

°C or below,

–

Heat time: 3 seconds or less (Per each side of the device).

Caution Apply only one kind of soldering condition to a device, except for “partial heating method”,

or the device will be damaged by heat stress.