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UM1865 Datasheet(PDF) 31 Page - STMicroelectronics

No. de pieza UM1865
Descripción Electrónicos  The purpose of this document is to describe the design of the application
PDF  132 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

UM1865 Datasheet(HTML) 31 Page - STMicroelectronics

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UM1865
Vendor specific commands
132
4.3.8
Aci_Gap_Set_Auth_Requirement
Description:
Set the authentication requirements for the device. If the OOB_Enable is set to 0, the
following 16 octets of OOB_Data will be ignored on reception. This command has to be
given only when the device is not in a connected state.
Table 32. Aci_Gap_Set_Auth_Requirement
Command name
Parameters
Return
Aci_Gap_Set_Auth_Requirement (0xFC86)
MIMT mode
OOB enable
OOB data
Min encryption key size
Max encryption key size
Use fixed pin
Fixed pin
Bonding mode
Status
Table 33. Aci_Gap_Set_Auth_Requirement command parameters
Parameter
Size
Description
MIMT mode
1 byte
0x00: MIMT not required
0x01: MIMT required
OOB enable
1 byte
0x00: Out Of Bound authentication not enabled
0x01: Out Of Bound authentication enabled
OOB data
16 bytes
OOB data
Min encryption key
size
1 byte
Minimum size of the encryption key to be used during the pairing
process
Max encryption key
size
1 byte
Maximum size of the encryption key to be used during the pairing
process
Use fixed pin
1 byte
0x00: Use fixed pin during the pairing process
0x01: Do not use fixed pin during the pairing process.
In this case, GAP will generate Evt_Blue_Pin_Code_Request
event to the host.
Fixed pin
4 bytes
Fixed pin to be used during pairing if MIMT protection is enabled.
Any random value between 0 to 999999
Bonding mode
1 byte
0x00: Bonding not required
0x01: Bonding required



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