CREAT BY ART

- Glass passivated chip junction

- Ideal for automated placement

- Super fast recovery time for high efficiency

- Halogen-free according to IEC 61249-2-21 definition

Molding compound, UL flammability classification rating 94V-0

Base P/N with suffix "G" on packing code - green compound (halogen-free)

Base P/N with prefix "H" on packing code - AEC-Q101 qualified

Terminal:

Matte tin plated leads, solderable per JESD22-B102

Meet JESD 201 class 1A whisker test

with prefix "H" on packing code meet JESD 201 class 2 whisker test

50

100

150

200

300

400

500

600

V

35

70

105

140

210

280

350

420

V

50

100

150

200

300

400

500

600

V

A

Trr

ns

Cj

pF

Document Number: DS_D1405069

Version: I14

ES3A thru ES3J

Taiwan Semiconductor

Surface Mount Super Fast Rectifiers

FEATURES

- Moisture sensitivity level: level 1, per J-STD-020

- Compliant to RoHS Directive 2011/65/EU and

in accordance to WEEE 2002/96/EC

ES

3C

ES

3D

MECHANICAL DATA

Case:

DO-214AB (SMC)

DO-214AB (SMC)

Polarity:

Indicated by cathode band

Weight:

0.21 g (approximately)

ES

3F

ES

3G

ES

3J

Unit

Maximum repetitive peak reverse voltage

Maximum RMS voltage

PARAMETER

SYMBOL

ES

3A

ES

3B

Maximum DC blocking voltage

Maximum average forward rectified current

3

Peak forward surge current, 8.3 ms single half sine-wave

superimposed on rated load

100

A

Maximum instantaneous forward voltage (Note 1)

V

10

μA

500

- 55 to +150

Storage temperature range

- 55 to +150

Note 1: Pulse test with PW=300μs, 1% duty cycle

Maximum reverse recovery time (Note 2)

35

Typical junction capacitance (Note 3)

Typical thermal resistance

12

47

Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.

ES

3H

0.95

1.3

1.7

45

30

Operating junction temperature range