LMP2231AMASLASHNOPB datasheet(3/31 Pages) TI

3 / 31 page

LMP2231

www.ti.com

SNOSB01E – JANUARY 2008 – REVISED MARCH 2013

Operating Ratings

(1)

Operating Temperature Range (2)

−40°C to 125°C

Supply Voltage (VS = V

+ - V−)

1.6V to 5.5V

Package Thermal Resistance (

θJA)

(2)

5-Pin SOT-23

160.6 °C/W

8-Pin SOIC

116.2 °C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage may occur. Operating Ratings indicate conditions for which the device

is intended to be functional, but specific performance is not ensured. For ensured specifications and test conditions, see the Electrical

Characteristics.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.

5V DC Electrical Characteristics

(1)

Unless otherwise specified, all limits ensured for TA = 25°C, V

+ = 5V, V− = 0V, V

CM = VO = V

+/2, and R

L > 1 MΩ. Boldface

limits apply at the temperature extremes.

Symbol

Parameter

Conditions

Min(2)

Typ(3)

Max(2)

Units

VOS

Input Offset Voltage

±10

±150

μV

±230

TCVOS

Input Offset Voltage Drift

LMP2231A

±0.3

±0.4

μV/°C

LMP2231B

±0.3

±2.5

IBIAS

Input Bias Current

0.02

±1

±50

IOS

Input Offset Current

CMRR

Common Mode Rejection Ratio

≤ VCM ≤ 4V

PSRR

Power Supply Rejection Ratio

1.6V

≤ V+ ≤ 5.5V

120

V− = 0V, VCM = 0V

CMRR

≥ 80 dB

−0.2

4.2

CMVR

Common Mode Voltage Range

CMRR

≥ 79 dB

−0.2

4.2

VO = 0.3V to 4.7V

110

AVOL

Large Signal Voltage Gain

120

RL = 10 kΩ to V

+/2

108

Output Swing High

RL = 10 kΩ to V

+/2

VIN(diff) = 100 mV

from either

rail

Output Swing Low

RL = 10 kΩ to V

+/2

VIN(diff) = −100 mV

Output Current (4)

Sourcing, VO to V

–

VIN(diff) = 100 mV

Sinking, VO to V

VIN(diff) = −100 mV

Supply Current

µA

(1)

Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very

limited self-heating of the device such that TJ = TA. No ensured specification of parametric performance is indicated in the electrical

tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond

which the device may be permanently degraded, either mechanically or electrically.

(2)

All limits are specified by testing, statistical analysis or design.

(3)

Typical values represent the most likely parametric norm at the time of characterization. Actual typical values may vary over time and

will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production

material.

(4)

The short circuit test is a momentary open loop test.

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