TC1014 datasheet(4/20 Pages) MICROCHIP

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TC1014/TC1015/TC1185

DS21335B-page 4

TC1014/TC1015/TC1185 ELECTRICAL SPECIFICATIONS (CONTINUED)

Electrical Characteristics: VIN =VR +1V, IL =100µA, CL =3.3µF, SHDN >VIH,TA = 25°C, unless otherwise noted. Boldface type

specifications apply for junction temperatures of -40°C to +125°C.

Symbol

Parameter

Min

Typ

Max

Units

Test Conditions

SHDN Input

VIH

SHDN Input High Threshold

—

%VIN

VIN =2.5V to6.5V

VIL

SHDN Input Low Threshold

—

%VIN

VIN =2.5V to6.5V

Note

The minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VR +VDROPOUT.

VR is the regulator output voltage setting. For example: VR = 1.8V, 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V.

Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range

from 1.0mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal

regulation specification.

Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V

differential.

Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or

line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the

thermal resistance from junction-to-air (i.e., TA,TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate

thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.

Apply for Junction Temperatures of -40°C to +85°C.

TC VOUT =(VOUTMAX –VOUTMIN)x 10

VOUT x ∆T

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