AS3695C datasheet(4/40 Pages) AMSCO

4 / 40 page

AS3695C

austriamicrosystems

www.austriamicrosystems.com

Rev 1.11 / 2010-12-08

3 - 39

Electrical Characteristics

3.1

Absolute Maximum Ratings

Stresses beyond those listed may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated in

Section “Electrical Characteristics” is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Symbol

Parameter

Min

Max

Unit

Note

Electrical Parameters

VDDMAX

Supply voltage

-0.3

Applicable for pin VDD

VIN_2.5V

Maximum voltage

-0.3

2.8

Applicable for 2.5V pins

(1)

VIN_5V

Maximum voltage

-0.3

VDD

+0.3V

Applicable for 5V pins

(2)

VIN_30V

Maximum voltage

-0.3

Applicable for 30V pins

(3)

Ilatch

Latch-Up immunity

-100

+100

Norm: JEDEC 78

Electrostatic Discharge

VESD_LV

Electrostatic Discharge on all 5V

pins

(1)

-2000

2000

Norm: MIL 883 E Method 3015

Human body model

VESD_HV

Electrostatic Discharge on 30V

pins

(2) against GND

-4000

4000

Norm: MIL 883 E Method 3015

Human body model

Continous Power Dissipation ( TA = +70°C )

Continous Power Dissipation

1.5

(4) for QFN64 Package

Continous Power Dissipation

Derating factor

mW/°

PDERATE

(5)

Temperature Ranges and Storage Conditions

Junctions temperature

+150

°C

TSTRG

Storage Temperature Range

-55

+150

°C

TBODY

Package body temperature

260

°C

The reflow peak soldering temperature (body

temperature) specified is in accordance with

IPC/JEDEC J-STD-020

“Moisture/Reflow SensitivityClassification

for Non-Hermetic Solid State Surface

Mount Devices”.

The lead finish for Pb-free leaded packages is matte

tin (100% Sn).

Humidity non condensing

Moisture Sensitive Level

Represents a max. floor life time of

168h

Note: (1) Pins V2_5, Filt1, Filt2

(2) Pins xRES, SDI, SCLK, SDO, xCS, VSYNC, HSYNC, VDD, xFault, FB1, FB2, G1-G16, S1-D16

(3) Pins D1 – D16

(4) Depending on actual PCB layout and PCB used

(5) PDERATE derating factor changes the total continuous power dissipation (PT) if the ambient

temperature is not 70ºC. Therefore for e.g. TA=85ºC calculate PT at 85ºC = PT - PDERATE x (85ºC - 70ºC)

3.2

Operating Conditions

3.2.1 General

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Rthja

Thermal resistance

junction – ambient

See chapter “Thermal characteristics”

°C/W

Tcase

Case Temperatur

-20

°C

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