M24M02-BRMN6TP datasheet(33/38 Pages) STMICROELECTRONICS

No. de pieza	M24M02-BRMN6TP

Descripción Electrónicos	2-Mbit serial IC bus EEPROM

PDF	38 Pages

Scroll/Zoom	100%

Fabricante Electrónico	STMICROELECTRONICS [STMicroelectronics]

Página de inicio	http://www.st.com

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33 / 38 page

DocID18204 Rev 8

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M24M02-DR

Package mechanical data

Figure 18. WLCSP- 8-bump, 3.556 x 2.011 mm, wafer level chip scale

package recommended footprint

1. Dimensions are expressed in millimeters.

Table 16. WLCSP- 8-bump, 3.556 x 2.011 mm, wafer level chip scale

package mechanical data

Symbol

millimeters

inches(1)

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Min

Typ

Max

Min

Typ

Max

0.500

0.540

0.580

0.0197

0.0213

0.0228

0.190

0.0075

0.350

0.0138

b(2)

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

0.270

0.0106

3.556

3.576

0.1400

0.1408

2.011

2.031

0.0792

0.0800

1.000

0.0394

1.200

0.0472

2.100

0.0827

0.505

0.0199

0.500

0.0197

0.728

0.0287

0.200

0.0079

aaa

0.110

0.0043

bbb

0.110

0.0043

ccc

0.110

0.0043

ddd

0.060

0.0024

eee

0.060

0.0024

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