3

Rev. 5/19/03

SP78LC00

100mA CMOS LDO Regulator

© Copyright 2003 Sipex Corporation

Note 1. Exceeding the absolute maximum rating may damage the device.

Note 2. The device is not guaranteed to function outside its operating rating.

Note 3. The maximum allowable power dissipation at any T

q

Exceeding the maximum allowable power dissipation will result in excessive die temperature,

and the regulator will go into thermal shutdown. The q

mounted on a PC board with minimum copper area (see “Thermal Considerations” section for

further details).

Note 4. Output voltage temperature coefficient is defined as the worst case voltage change divided by the

total temperature range.

Note 5. Load Regulation is measured at constant junction temperature using low duty cycle pulse testing.

Parts are tested for load regulation in the load range; from 0.1mA to 100mA. Changes in output

voltage due to heating effects are covered by the thermal regulation specification.

Note 6. Dropout Voltage is defined as the input to output differential at which the output voltage drops 2%

below its nominal value measured at 1V differential.

Note 7. Ground pin current is the regulator quiescent current. The total current drawn from the supply is the

sum of the load current plus the ground pin current.

Note 8. Thermal regulation is defined as the change in output voltage at a time ”t” after a change in power

dissipation is applied, excluding load or line regulation effects. Specifications are for a 100mA load

pulse at V

ELECTRICAL SPECIFICATIONS: Continued

PIN NUMBER

NAME

FUNCTION

1

GND

Ground

2INSupply Input Voltage

3OUT

Regulator Output Voltage

4,5

NC

No Connection

PIN ASSIGNMENTS

FUNCTIONAL DIAGRAM

V

IN

Current Limit

+

-

1.25V

1.20V

Bandgap

REF

and Thermal

Shutdown

GND

R1

OUT

IN

R2

C

OUT

C

IN