LM2941, LM2941C

SNVS770I – JUNE 1999 – REVISED JANUARY 2015

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6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

LM2941T, LM2941S, LM2941LD

60

V

Input voltage (Survival Voltage,

≤ 100 ms)

LM2941CT, LM2941CS

45

V

Internally Limited

Maximum junction temperature

150

°C

TO-220 (T), Wave, 10 s

260

°C

TO-263 (S), 30 s

235

°C

WSON-8 (LD), 30 s

235

°C

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

go into thermal shutdown. If the TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper

material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package,

refer to Application Note AN-1187 (SNOA401). It is recommended that 6 vias be placed under the center pad to improve thermal

performance.

(4)

Refer to JEDEC J-STD-020C for surface mount device (SMD) package reflow profiles and conditions. Unless otherwise stated, the

temperature and time are for Sn-Pb (STD) only.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

LM2941T

−40

125

LM2941CT

0

125

Temperatures

LM2941S

−40

125

°C

LM2941CS

0

125

LM2941LD

−40

125

4

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