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MB2S Datasheet(PDF) 1 Page - GUANGDONG HOTTECH INDUSTRIAL CO.,LTD. |
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MB2S Datasheet(HTML) 1 Page - GUANGDONG HOTTECH INDUSTRIAL CO.,LTD. |
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1 / 2 page ![]() Page:P2-P1 GUANGDONG HOTTECH INDUSTRIAL CO,. LTD. FEATURES • Plastic package has Underwriters Laboratory Flammability Classification 94V-0 • Glass passivated chip junctions • High surge overload rating: 35A peak • Saves space on printed circuit boards • High temperature soldering guaranteed: 260 C/10 seconds. Maximum Ratings and Electrical Characteristics (T =25 oC unless otherwise noted) Parameter Symbols MB2S MB4S MB6S MB8S MB10S Unit Maximum repetitive peak reverse voltage VRRM 200 400 600 800 1000 Volts Maximum RMS voltage VRMS 140 280 420 560 700 Volts Maximum DC blocking voltage VDC 200 400 600 800 1000 Volts Maximum average forward output rectified current (see Fig.1) on glass-epoxy P.C.B. on aluminum substrate IF(AV) 0.5 (1) 0.8 (2) Amp Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 30.0 Amps Rating for fusing (t < 8.3ms) I2t 5.0 A2sec Maximum instantaneous forward voltage drop per leg at 0.4A VF 1.0 Volt Maximum DC reverse current at TA = 25 o C rated DC blocking voltage per leg TA = 125 o C IR 5.0 500 uA Typical thermal resistance per leg RθJA RθJA RθJL 85 (1) 70 (2) 20 (1) o C/W Typical junction capacitance per leg at 4.0V, 1.0MHz CJ 13 pF Operating junction and storage temperature range TJ, TSTG -55 to +150 o C Notes: 1. On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads 2. On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad MB2S---MB10S Unit:mm .106(2.7) .090(2.3) .106(2.7) .090(2.3) .051(1.3) .035(0.9) .014(0.35) .006(0.15) .043(1.1) .027(0.7) .275(7)MAX .165(4.2) .150(3.8) .031(0.8) .019(0.5) .193(4.9) .177(4.5) .067(1.7) .057(1.3) .008(.20) CASE:MB-S o Mechanical Data • Case: Transfer Molded Epoxy • Mounting Position: Any • Polarity: Polarity Symbols Marked on Body |
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