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OM6206U/Z Datasheet(PDF) 28 Page - NXP Semiconductors

No. de pieza OM6206U/Z
Descripción Electrónicos  65 X 102 pixels matrix LCD driver
PDF  36 Pages
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Fabricante Electrónico  PHILIPS [NXP Semiconductors]
Página de inicio  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

OM6206U/Z Datasheet(HTML) 28 Page - NXP Semiconductors

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2001 Nov 14
28
Philips Semiconductors
Product specification
65
× 102 pixels matrix LCD driver
OM6206
Note
1. All x/y coordinates (in
µm) are referenced to the centre
of the chip (see Fig.20).
Table 9
Bonding pad dimensions
VSS2
212
−430
+935
VSS2
213
−510
+935
VSS1
214
−670
+935
VSS1
215
−750
+935
VSS1
216
−830
+935
VSS1
217
−910
+935
T1
218
−1150
+935
T5
219
−1630
+935
T4
220
−2030
+935
VSS1
221
−2110
+935
VSS1
222
−2190
+935
T3
223
−2270
+935
VLCDIN
224
−2510
+935
VLCDIN
225
−2590
+935
VLCDIN
226
−2670
+935
VLCDIN
227
−2750
+935
VLCDIN
228
−2830
+935
VLCDIN
229
−2910
+935
VLCDOUT
230
−3070
+935
VLCDOUT
231
−3150
+935
VLCDOUT
232
−3230
+935
VLCDOUT
233
−3310
+935
VLCDOUT
234
−3390
+935
VLCDOUT
235
−3470
+935
VLCDOUT
236
−3550
+935
VLCDSENSE
237
−3630
+935
Alignment marks
Circle 1
−5185
−910
Circle 2
+5185
−910
Circle 3
+4160
+910
Circle 4
−4160
+910
SYMBOL
PAD
COORDINATES(1)
xy
NAME
DIMENSION
Pad pitch
70
µm
Pad size, aluminium
62
× 100 µm
Bump dimensions
50
× 90 × 17.5 (±5) µm
Wafer thickness (including
bumps)
maximum 430
µm
Wafer thickness (without
bumps)
typical 380
µm



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