Copyright 2000 National Semiconductor Corp.

5

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2.0 Package information

FIGURE 2. 100 pins TP Quad Flat Pack. NS Package Number VJG100A

FIGURE 3. 100 pins Chip Scaled Package. NS package SLC100A

1

2

3

4

5

6

7

8

9

10

A

B

C

D

E

F

G

H

J

K

0.8 TYP

(7.2 TYP)

(1.4 TYP)

0.36 +- 0.05 TYP

1.4 0.1

+

-

0.46 TYP

10

0.2

+

-

10 0.2

+

-

A1 BALL PAD CORNER

A1 BALL PAD CORNER

Bottom view

Top view

Dimensions are in milimeters

Note 2

N

Note 3

SEATING PLANE

Note 3

0.1

0.15 M N

0.08 M N

L S M S

NOTES: UNLESS OTHERWISE SPECIFIED

1. SOLDER BALL COMPOSITION: Sn 63%, Pb 37%

2. DIMENSIONS MEASURED AT MAXIMUM SOLDER BALL DIAMETER,

PARALLEL TO PRIMARY DATUM N

3. PRIMARY DATUM N AND SEATING PLANE ARE DEFINED BY THE SPHERICAL

CROWNS OF THE SOLDER BALLS

L

M

4. NO JEDEC REGISTRATION AS OF JUNE 1998