SAW FILTER

HDF40A

W2

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Page 5 of 5

area of the terminals must be covered with new solder. It shall meet the specifications in

2.2.

5

-6 Mechanical shock

Drop the device randomly onto the concrete floor from the height of 1m 3 times. the

device shall fulfill the specifications in 2.2.

5-7 Vibration

Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of

1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in 2.2.

6. REMARK

6.1 Static voltage

Static voltage between signal load & ground may cause deterioration &destruction of

the component. Please avoid static voltage.

6.2 Ultrasonic cleaning

Ultrasonic vibration may cause deterioration & destruction of the component. Please

avoid ultrasonic cleaning

6.3 Soldering

Only leads of component may be solded. Please avoid soldering another part of

component.