© 2016 Littelfuse, Inc.

Specifications are subject to change without notice.

Revised: 08/22/16

Surface Mount > 2016L Series

Environmental Specifications

Soldering Parameters

Operating/Storage

Temperature

-40°C to +85°C

Maximum Device Surface

Temperature in Tripped

State

125°C

Passive Aging

+85°C, 1000 hours

-/+5% typical resistance change

Humidity Aging

+85°C, 85%,R.H.,1000 hours

-/+5% typical resistance change

Thermal Shock

MIL–STD–202, Method 107

+85°C/-40°C 20 times

-30% typical resistance change

Solvent Resistance

MIL–STD–202, Method 215

No change

Vibration

MIL–STD–883, Method 2007,

Condition A

No change

Moisture Sensitivity Level

Level 1, J–STD–020

Physical Specifications

Terminal Material

Solder-Plated Copper (Solder Material:

Matte Tin(Sn))

Lead Solderability

Meets EIA Specification RS186-9E, ANSI/

J-STD-002 Category 3.

Time

25

time to peak temperature

Preheat

Preheat

Ramp-up

Ramp-up

Ramp-down

Ramp-do

Critical Zone

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (T

3°C/second max

Pre Heat:

Temperature Min (T

150°C

Temperature Max (T

200°C

Time (Min to Max) (t

60 – 180 secs

Time Maintained

Above:

Temperature (T

217°C

Temperature (t

60 – 150 seconds

Peak / Classification Temperature (T

Time within 5°C of actual peak

Temperature (t

20 – 40 seconds

Ramp-down Rate

6°C/second max

Time 25°C to peak Temperature (T

8 minutes Max.

-- All temperature refer to topside of the package, measured on the package body surface

-- If reflow temperature exceeds the recommended profile, devices may not meet the

performance requirements

-- Recommended reflow methods: IR, vapor phase oven, hot air oven, N

for lead

-- Recommended maximum paste thickness is 0.25mm (0.010inch)

-- Devices can be cleaned using standard industry methods and solvents

-- Devices can be reworked using the standard industry practices