TC1413/TC1413N

DS20001392E-page 12

 2001-2015 Microchip Technology Inc.

Microchip Technology Drawing No. C04-018D Sheet 2 of 2

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

INCHES

Dimension Limits

MIN

NOM

MAX

Number of Pins

N

8

Pitch

e

.100 BSC

Top to Seating Plane

A

-

-

.210

Molded Package Thickness

A2

.115

.130

.195

Base to Seating Plane

A1

.015

Shoulder to Shoulder Width

E

.290

.310

.325

Molded Package Width

E1

.240

.250

.280

Overall Length

D

.348

.365

.400

Tip to Seating Plane

L

.115

.130

.150

Lead Thickness

c

.008

.010

.015

Upper Lead Width

b1

.040

.060

.070

Lower Lead Width

b

.014

.018

.022

Overall Row Spacing

eB

-

-

.430

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

3.

1.

protrusions shall not exceed .010" per side.

2.

4.

Notes:

§

--

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or

Pin 1 visual index feature may vary, but must be located within the hatched area.

§ Significant Characteristic

Dimensioning and tolerancing per ASME Y14.5M

e

DATUM A

DATUM A

e

b

e

2

b

e

2

ALTERNATE LEAD DESIGN

(VENDOR DEPENDENT)