TAS5110

SLES028A – MAY 2002 – REVISED SEPTEMBER 2002

19

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MECHANICAL DATA

DAD (R-PDSO-G**)

PowerPAD

 PLASTIC SMALL-OUTLINE (DIE DOWN)

0,25

0,75

0,50

0,15 NOM

Gage Plane

NOM

6,20

8,40

7,80

(See Note D)

Thermal Pad

38

12,60

32

11,10

Seating Plane

12,40

10,90

4073258/A 01/98

20

0,19

19

A

0,30

38 PINS SHOWN

38

1

A MAX

PINS **

A MIN

DIM

1,20 MAX

10,90

11,10

30

0,10

0,65

M

0,13

0

°–8°

0,15

0,05

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions include mold flash or protrusion.

D. The package thermal performance may be enhanced by attaching an external heatsink to the thermal pad.

This pad is electrically and thermally connected to the backside of the die and possibly selected leads.

E. Falls within JEDEC MO-153

PowerPAD is a trademark of Texas Instruments Incorporated.