AD8398A

Rev. D | Page 4 of 12

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

13.2 V

Power Dissipation

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation for the AD8398A is limited

transition temperature of the plastic, is 150°C. Temporarily

exceeding this limit may cause a shift in the parametric

performance due to a change in the stresses exerted on the

die by the package. Exceeding this limit for an extended period

can result in device failure.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 16-lead LFCSP_WQ

on a 4-layer board with six vias connecting the exposed pad to

the GND plane layer.

AMBIENT TEMPERATURE (°C)

0

5

4

3

2

1

6

–40 –30 –20 –10

0

10

20

30

40

50

60

80

70

THERMAL RESISTANCE

board and the thermal pad connected to the GND plane layer

using six vias.

Table 3. Thermal Resistance

Package Type

Unit

16-Lead LFCSP_WQ

35.6

°C/W

Figure 3. Maximum Safe Power Dissipation vs. Ambient Temperature,

4-Layer JEDEC Board with Six Thermal Vias

ESD CAUTION