TM

Innovative Technology

for a Connected World

Thermally Conductive PCB Substrate

THERMALLY CONDUCTIVE PRINTED CIRCUIT BOARD SUBSTRATE

Tlam SS HTD is a thermally conductive PCB substrate. The construction consists of a copper circuit layer

bonded to an aluminum or copper base plate with 150 C rated Tlam HTD dielectric. Tlam SS HTD laminate

is processed through standard FR4 print and etch operations.

Tlam SS HTD products have 6-8 times better thermal conductivity than FR4--key to keeping components cool.

The Tlam SS HTD boards are run through standard pick and place SMT and manual wire bond processes.

Tlam SS HTD is designed for use in high temperature and/or high-voltage applications typically found in

industrial motor drives and automotive motor controls.

Standard constructions are made with 1 and 2 ounce copper and 0.040 (1mm) and 0.062 (1.6mm) inch thick

aluminum. Custom construction of heavier weight circuit copper and thicker aluminum and copper base

plates are also available.

FEATURES AND BENEFITS

• Lower thermal resistance

•Highwithstandvoltage>6000VDC

•RoHScompliant

•Environmentallygreen

•Significantlyreducespowerdevicetemperature

•Leadfreesoldercompatible

Americas: +1.800.843.4556

Europe: +49.8031.2460.0

Asia: +86.755.2714.1166

CLV-customerservice@lairdtech.com

www.lairdtech.com/thermal

APPLICATIONS

• Automotive-LVunderhoodandEVmotordrives

• 120-480VACcommercialandindustrialmotor

drives,UPSandwelders

• PowerSupplies-AC/DCandDC/DCfortelecom

and commercial products