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Document Number: 28744

364

Revision: 11-Jun-12

MCS 0402 VG01, MCT 0603 VG01, MCU 0805 VG01, MCA 1206 VG01

Vishay Beyschlag

Thin Film Chip Resistors with Established Reliability

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

DIMENSIONS

Note

• Resistors MCA 1206 VG01 and MCU 0805 VG01 are marked using to the four-character code system of IEC 60062, 4.2.3.

Resistors MCT 0603 VG01 and MCS 0402 VG01 do not show any marking on their light blue protective coating.

Note

• The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in

publication IPC 7351. They do not guarantee any supposed thermal properties, however, they will be found adequate for most general

applications.

DIMENSIONS AND MASS

TYPE

H

(mm)

L

(mm)

W

(mm)

(mm)

(mm)

(mm)

MASS

(mg)

MCS 0402 VG01

0.32 ± 0.05

1.0 ± 0.05

0.5 ± 0.05

> 75 % of W

0.2 ± 0.1

0.2 + 0.1/- 0.15

0.6

MCT 0603 VG01

0.45 + 0.1/- 0.05

1.55 ± 0.05

0.85 ± 0.1

0.3 + 0.15/- 0.2

1.9

MCU 0805 VG01

0.45 + 0.1/- 0.05

2.0 ± 0.1

1.25 ± 0.15

0.4 + 0.1/- 0.2

4.6

MCA 1206 VG01

0.55 ± 0.1

3.2 + 0.1/- 0.2

1.6 ± 0.15

0.5 ± 0.25

9.2

RECOMMENDED SOLDER PAD DIMENSIONS

TYPE

WAVE SOLDERING

REFLOW SOLDERING

G

(mm)

Y

(mm)

X

(mm)

Z

(mm)

G

(mm)

Y

(mm)

X

(mm)

Z

(mm)

MCS 0402 VG01

-

-

-

-

0.35

0.55

0.55

1.45

MCT 0603 VG01

0.55

1.10

1.10

2.75

0.65

0.70

0.95

2.05

MCU 0805 VG01

0.80

1.25

1.50

3.30

0.90

0.90

1.40

2.70

MCA 1206 VG01

1.40

1.50

1.90

4.40

1.50

1.15

1.75

3.80

T

t

L

W

T

b

H

W

T

G

X

Y

Z