TMP93CS41DF datasheet(40/48 Pages) TOSHIBA

40 / 48 page

Quality and Reliability Assurance / Handling Precautions

030901

QUA-40

2002-02-20

4.3.15 Other Precautions

(1)

When designing a system, be sure to incorporate fail-safe and other

appropriate measures according to the intended purpose of your system.

Also, be sure to debug your system under actual board-mounted

conditions.

(2)

If a plastic-package device is placed in a strong electric field, surface

leakage may occur due to the charge-up phenomenon, resulting in device

malfunction. In such cases, take appropriate measures to prevent this

problem, for example by protecting the package surface with a conductive

shield.

(3)

With some microcomputers and MOS memory devices, caution is required

when powering on or resetting the device. To ensure that your design does

not violate device specifications, consult the relevant databook for each

constituent device.

(4)

Ensure that no conductive material or object (such as a metal pin) can

drop onto and short the leads of a device mounted on a printed circuit

board.

4.4

Inspection, Testing and Evaluation

4.4.1

Grounding

Ground all measuring instruments, jigs, tools and soldering irons to

earth.

Electrical leakage may cause a device to break down or may result in

electric shock.

4.4.2

Inspection Sequence

x Do not insert devices in the wrong orientation. Make sure that the

positive and negative electrodes of the power supply are correctly

connected. Otherwise, the rated maximum current or maximum

power dissipation may be exceeded and the device may break down

or undergo performance degradation, causing it to catch fire or

explode, resulting in injury to the user.

y When conducting any kind of evaluation, inspection or testing using

AC power with a peak voltage of 42.4 V or DC power exceeding 60

V, be sure to connect the electrodes or probes of the testing

equipment to the device under test before powering it on.

Connecting the electrodes or probes of testing equipment to a device

while it is powered on may result in electric shock, causing injury.

(1)

Apply voltage to the test jig only after inserting the device securely into it.

When applying or removing power, observe relevant precautions, if any.

(2)

Make sure that the voltage applied to the device is off before removing the

device from the test jig. Otherwise, the device may undergo performance

degradation or be destroyed.

TMP93CS41DF Datasheet(PDF) 40 Page - Toshiba Semiconductor

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