LPS35HW datasheet(21/48 Pages) STMICROELECTRONICS

No. de pieza	LPS35HW

Descripción Electrónicos	Embedded temperature compensation

PDF	48 Pages

Scroll/Zoom	100%

Fabricante Electrónico	STMICROELECTRONICS [STMicroelectronics]

Página de inicio	http://www.st.com

Logo

21 / 48 page

LPS35HW

Application hints

DocID029129 Rev 1

21/48

Application hints

Figure 13: LPS35HW electrical connections (top view)

The device power supply must be provided through the VDD line; power supply decoupling

capacitor C1 (100 nF) must be placed as near as possible to the supply pads of the device.

Depending on the application, an additional capacitor of 4.7 µF could be placed on VDD

line.The functionality of the device and the measured data outputs are selectable and

accessible through the I²C/SPI interface. When using the I2C, CS must be tied to Vdd_IO.

All the voltage and ground supplies must be present at the same time to have proper

behavior of the IC (refer to Figure 13: "LPS35HW electrical connections (top view)"). It is

possible to remove VDD while maintaining Vdd_IO without blocking the communication

bus, in this condition the measurement chain is powered off.

LPS35HW Datasheet(PDF) 21 Page - STMicroelectronics