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STULED623 Datasheet(PDF) 5 Page - STMicroelectronics

No. de pieza STULED623
Descripción Electrónicos  Very low intrinsic capacitance
PDF  18 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STULED623 Datasheet(HTML) 5 Page - STMicroelectronics

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DocID025178 Rev 1
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STDLED623, STULED623
Electrical characteristics
The built-in back-to-back Zener diodes have specifically been designed to enhance not only
the device’s ESD capability, but also to make them safely absorb possible voltage transients
that may occasionally be applied from gate to source. In this respect the Zener voltage is
appropriate to achieve efficient and cost-effective intervention to protect the device’s
integrity. These integrated Zener diodes thus avoid the usage of external components.
Table 7. Switching times
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
td(on)
Turn-on delay time
VDD = 310 V, ID =1.1 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 15)
-8
-
ns
tr
Rise time
-
4.4
-
ns
td(off)
Turn-off-delay time
-
21
-
ns
tf
Fall time
-
22
-
ns
Table 8. Source-drain diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max. Unit
ISD
Source-drain current
-
2.2
A
ISDM
(1)
1.
Pulse width limited by safe operating area.
Source-drain current (pulsed)
-
8.8
A
VSD
(2)
2.
Pulsed: Pulse duration = 300 µs, duty cycle 1.5%.
Forward on voltage
ISD = 2.2 A, VGS = 0
-
1.6
V
trr
Reverse recovery time
ISD = 2.2 A, di/dt = 100 A/µs
VDD = 60 V (see Figure 20)
-
200
ns
Qrr
Reverse recovery charge
-
900
nC
IRRM
Reverse recovery current
-
9
A
trr
Reverse recovery time
ISD = 2.2 A, di/dt = 100 A/µs
VDD = 60 V, Tj = 150 °C
(see Figure 20)
-
240
ns
Qrr
Reverse recovery charge
-
1150
nC
IRRM
Reverse recovery current
-
10
A
Table 9. Gate-source Zener diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max. Unit
BVGSO
Gate-source breakdown
voltage
IGS = ± 1 mA (open drain)
30
-
-
V
Obsolete
Product(s)
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Product(s)



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