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SO14 Datasheet(PDF) 1 Page - STMicroelectronics |
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SO14 Datasheet(HTML) 1 Page - STMicroelectronics |
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1 / 2 page ![]() Thermal Data SO 14 item # material thickness thermal conductivity leadframe copper 0.20 mm 2.61 W/cm°C die attach epoxy glue ( silver filler ) 10-40 µm 0.01 W/cm°C molding compound epoxy resin 1.65 mm 0.0063W/cm°C PACKAGE MATERIAL LIST Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time width and die size February 1998 1/2 14 leads ® |
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