| Motor de Búsqueda de Datasheet de Componentes Electrónicos |
|
MPXM2102AS Datasheet(PDF) 89 Page - Motorola, Inc |
|
|
|||||||||||||||||||||||||||||
MPXM2102AS Datasheet(HTML) 89 Page - Motorola, Inc |
|
89 / 670 page ![]() MMA2202D 2–53 Motorola Sensor Device Data www.motorola.com/semiconductors * When positioned as shown, the Earth’s gravity will result in a positive 1g output Positive Acceleration Sensing Direction 10 11 12 13 14 15 16 8 7 6 5 4 3 2 1 9 16–Pin SOIC Package N/C pins are recommended to be left FLOATING –X +X 10 11 12 13 14 15 16 8 7654321 9 Direction of Earth’s gravity field.* Front View Top View Side View ORDERING INFORMATION Device Temperature Range Case No. Package MMA2202D *40 to +85°C Case 475–01 SOIC–16 MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection inter- face between the board and the package. With the correct footprint, the packages will self–align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and short- ing between solder pads. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
|
Enlace URL |
| ¿ALLDATASHEET es útil para Ud.? [ DONATE ] |
Todo acerca de Alldatasheet | Publicidad | Contáctenos | Política de Privacidad | Enlace a la hoja de datos | Intercambio de Enlaces | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |