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CSP545S-A Datasheet(PDF) 1 Page - Chip Integration Technology Corporation

No. de pieza CSP545S-A
Descripción Electrónicos  5A Surface Mount Low Barrier Diode
PDF  3 Pages
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Fabricante Electrónico  CITC [Chip Integration Technology Corporation]
Página de inicio  http://www.citcorp.com.tw/english/index.php
Logo CITC - Chip Integration Technology Corporation

CSP545S-A Datasheet(HTML) 1 Page - Chip Integration Technology Corporation

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1
Dimensions in inches and (millimeters)
■ Features
Mechanical data
■ Maximum ratings and electrical characteristics
O
Rating at 25 C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
■ Outline
Low forward voltage drop.
Excellent high temperature stability.
Fast switching capability.
Suffix "G" indicates Halogen-free part, ex.CSP545SG-A.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
5A Surface Mount Low Barrier Diode
Forward rectified current
Forward surge current
Thermal resistance
Operating and Storage temperature
Parameter
Forward voltage drop
Reverse current
Parameter
Marking code
DC blocking voltage
Working peak reverse voltage
Peak repetitive reverse voltage
TO-277
0.216 (5.48)
0.208 (5.28)
0.264 (6.70)
0.248 (6.30)
0.028 (0.71)
0.016 (0.41)
0.028 (0.71)
0.016 (0.41)
0.073 (1.85)
0.069 (1.75)
0.145 (3.69)
0.133 (3.39)
0.069 (1.74)
0.057 (1.44)
0.037 (0.95)
0.033 (0.85)
0.037 (0.95)
0.033 (0.85)
0.124 (3.15)
0.112 (2.85)
0.049 (1.25)
0.037 (0.95)
0.014 (0.35)
0.010 (0.25)
PIN 2
1
3
2
• Epoxy : UL94-V0 rated flame retardant.
.
• Case : Molded plastic, TO-277
• Lead : Solder plated, solderable per MIL-STD-750,
Method 2026.
.
• Polarity: Indicated by cathode band
.
• Mounting Position : Any
.
• Weight : Approximated 0.093 grams
0.077 (1.96)
0.069 (1.76)
PIN 1
PIN 3
Note : 1.Theoretical RθJS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
2.Polymide PCB, 2oz.Copper.
I
O
I
F S M
R
θ J S
T , T
J
S T G
8.3ms single half sine-wave superimposed on
rate load (JEDEC method)
Conditions
Symbol
CSP545S-A
UNIT
-65 ~ +150
5
120
A
A
O C/W
O C
60
R
θ J A
Junction to ambient(2)
O C/W
Junction to soldering(1)
3
CSP545S
V
R M
V
RW M
V
R R M
45
V
CSP545S-A
Document ID : DS-12KEL
Revised Date : 2014/11/03
Revision : C1
V
F
I
R
O
V
= V
T = 25 C
R
R R M
J
Conditions
Symbol
TYP.
UNIT
100
0.5
mV
mA
MIN.
MAX.
O
I = 5A, T = 25 C
F
J
O
I = 5A, T = 125 C
F
J
520
530
550
O
V
= V
T = 125 C
R
R R M
J


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