LC450029PKB

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2

Specifications

Parameter

Symbol

Conditions

Ratings

Unit

Maximum supply voltage

VDD max,

VDDI max

VDD=VDDI

0.3 to +6.5

V

Input voltage

VIN1

CE, CL, DI, INH

0.3 to +6.5

V

VIN2

OSCI

0.3 to VDDI+0.3

Output voltage

VOUT

S1 to S53, COM1 to COM4

0.3 to VDD+0.3

V

Output current

IOUT1

S1 to S53

300

A

IOUT2

COM1 to COM4

3

mA

Operating temperature

Topr

40 to +105

C

Storage temperature

Tstg

55 to +125

C

(Note) Power supply pads (VDD, VDDI) should connect all pads to the same power supply.

(See sample applications circuits)

Parameter

Symbol

Conditions

Ratings

Unit

min

typ

max

Supply voltage

VDD,

VDDI

VDD=VDDI

4.5

6.0

V

Input high-level voltage

VIH1

CE, CL, DI, INH

0.8VDD

6.0

V

VIH2

OSCI: External clock operating mode

0.8VDD

VDDI

Input low-level voltage

VIL1

CE, CL, DI, INH

0

0.2VDDI

V

VIL2

OSCI: External clock operating mode

0

0.2VDDI

External

clock

operating

frequency

fCK

OSCI: External clock operating mode

[Figure 4]

10

300

600

kHz

External clock duty cycle

DCK

OSCI: External clock operating mode

[Figure 4]

30

50

70

%

Data setup time

tds

CL, DI

[Figure 2] [Figure 3]

160

ns

Data hold time

tdh

CL, DI

[Figure 2] [Figure 3]

160

ns

CE wait time

tcp

CE, CL

[Figure 2] [Figure 3]

160

ns

CE setup time

tcs

CE, CL

[Figure 2] [Figure 3]

160

ns

CE hold time

tch

CE, CL

[Figure 2] [Figure 3]

160

ns

High-level clock pulse width

t

H

CL

[Figure 2] [Figure 3]

160

ns

Low-level clock pulse width

t

L

CL

[Figure 2] [Figure 3]

160

ns

Rise time

tr

CE, CL, DI

[Figure 2] [Figure 3]

160

ns

Fall time

tf

CE, CL, DI

[Figure 2] [Figure 3]

160

ns

INH switching time

tc

INH, CE

[Figure 5] [Figure 6]

10

s

(Note) Power supply pads (VDD, VDDI) should connect all pads to the same power supply.

(See sample applications circuits)

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed,

damage may occur and reliability may be affected.

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended

Operating Ranges limits may affect device reliability.