MP7610

6

Rev. 4.01

25

Tmin to Tmax

ELECTRICAL CHARACTERISTICS (CONT’D)

Specifications are subject to change without notice

Parameter

Symbol

Min

Typ

Max

Min

Max

Units

Test Conditions/Comments

DIGITAL TIMING

LD Rising Edge to SDO

50

ns

Tri-state Disable

LD Rising Edge to CLK Enable

50

ns

LD Set-up Time with Respect

45

ns

to CLK

NOTES:

1

Guaranteed; not tested.

2

Specified values guarantee functionality.

3

4

5

6

Digital feedthrough and channel-to-channel crosstalk are heavily dependent on the board layout and environment.

ABSOLUTE MAXIMUM RATINGS (TA = +25

+16.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . .

--16.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . .

+6.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . .

+7.0 V

. . . . . . . . . . . . . . . . . . . . . . . . . . .

AGND to DGND

+1 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . .

(Functionality guaranteed for ¦0.5 V only)

Digital Input & Output Voltage

to DGND

. . . . . . . . . . . . . . . . . . . .

Analog Inputs & Outputs

Indefinite Shorts to

. . . . . . .

dissipation of the package spec is not exceeded)

Operating Temperature Range

Extended Industrial

--40°C to +85°C

. . . . . . . . . . . . . .

Maximum Junction Temperature

--65°C to 150°C

. . .

Storage Temperature

150°C

. . . . . . . . . . . . . . . . . . . . . .

Lead Temperature (Soldering, 10 sec)

+300°C

. . . . .

Package Power Dissipation Rating @ 75°C

SOIC, PLCC

1150mW

. . . . . . . . . . . . . . . . . . . . . . . . . . .

Derates above 75°C

15mW/°C

. . . . . . . . . . . . . . . . . . . .

NOTES:

1

Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a

stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating

conditions for extended periods may affect device reliability.

2

Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps

(HP5082-2835) from input pin to the supplies. All inputs have protection diodes which will protect the device from short

APPLICATION NOTES

NOTE: When using these DACs to drive remote devices, the accuracy of the output can be improved by utilizing a remote analog

ground connection. The difference between the DGND and AGND should be limited to ¦300 mV to assure normal operation. If there

is any chance that the AGND to DGND can be greater than ¦1 V, we recommend two back-to-back diodes be used between DGND

and AGND to clamp the voltage and prevent damage to the DAC. Using a buffer between the remote ground location and AGND may

help reduce noise induced from long lead or trace lengths.