Product Description
Soder-Wick® offers the state of the art in desoldering technology. Soder-Wick is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick® responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage.
Soder-Wick Rosin has the fastest desoldering action in the industry. Flux residues must be cleaned after the rework process.

Typical Applications
Soder-Wick® desoldering braid safely removes solder from:
§ Thru-hole Components
§ SMT Pads and BGA Pads
§ Micro Circuits
§ Terminals
§ Lugs and Posts
§ Identification Script