1-770-424-4888 Ÿ www.chemtronics.com

Rev. G (9/18) Page 2 of 2

VacuPakÔPackaging

The VacuPakÔ Can contains

ten five-foot bobbins in a

vacuum sealed can. This

package provides the highest

level of cleanliness and

freshness. Great for tool kit

storage.

Part #

Size

SW18015

1

SW18025

2

SW18035

3

SW18045

4

SW18055

5

Part #

Size

Length

Part #

Size

Length

Part #

Size

Length

Part #

Size

Length

Part #

Size

Length

80-1-5

1

5’

80-1-10

1

10’

50-1-25

1

25’

80-2-5

2

5’

80-2-10

2

10’

50-2-25

2

25’

50-2-100

2

100’

50-2-500

2

500’

80-3-5

3

5’

80-3-10

3

10’

50-3-25

3

25’

50-3-100

3

100’

80-4-5

4

5’

80-4-10

4

10’

50-4-25

4

25’

50-4-100

4

100’

80-5-5

5

5’

80-5-10

5

10’

50-5-25

5

25’

80-6-5

6

5’

50-6-25

6

25’

8125 Cobb Center Drive, Kennesaw, GA 30152 Ÿ 1-770-424-4888 Ÿ www.chemtronics.com

Soder-WickÒ Rosin Flux

Desoldering Braid

Usage Instructions

For industrial use only. Read SDS carefully prior to use.

1) Choose a Soder-WickÒ braid width equal to or slightly

larger than the pad or connection.

2) Choose a solder iron tip equal to or slightly larger than

the pad or connection.

3) Set temperature of iron between 600-750

°F.

4) Place wick on solder joint and place tip of hot iron on

top of wick.

5) As solder becomes molten, the color of the wick will

change from copper to silver.

6) Remove wick and iron from joint simultaneously once

color change has stopped.

7) The component lead / pad is now clean and free from

solder.

8) Clip and discard used portion of the wick

9) If needed, clean PCB with CircuitWorks Flux Remover

Pen and remove soils with a ControlWipes absorbent

wipe.

Availability

Soder-Wick Is Designed To Meet or Exceed the

Following:

§

MIL-F-14256F, Type R

§

NASA-STD-8739.3

§

DOD-STD-883E, Method 2022

§

ANSI/IPC J STD-004, Type ROL0

§

BELLCORE TR-NWT-000078

§

ANSI/IPC J SF-818

HELPFUL HINTS:

Water Soluble Users: Use Soder-Wick Unfluxed 70 or 75

Series to dip in water soluble flux and then desolder normally.

Ball Grid Array: Use #6 red Soder-Wick with a large tipped

iron to remove solder from a number of BGA pads all at once.

Technical and Application Assistance

Chemtronics provides a technical hotline to answer your

technical and application related questions.

The toll free number is: 1-800-TECH-401.

Note:

This information is believed to be accurate. It is intended for

professional end users having the skills to evaluate and use

the data properly. CHEMTRONICS does not guarantee the

accuracy of the data and assumes no liability in connection

with damages incurred while using it.

Chemtronics

â, Soder-Wickâ and CircuitWorksâ are registered trademarks of

Chemtronics. All rights reserved. Vacu-Pak

ä and ControlWipesä are trademarks

of Chemtronics. All rights reserved.