LTM4650-1 datasheet(8/36 Pages) LINER

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LTM4636

4636f

For more information www.linear.com/LTM4636

pin FuncTions

SGND(F4,G4):SignalGroundPin.Returngroundpathfor

all analog and low power circuitry. Tie a single connection

to the output capacitor GND in the application. See layout

guidelines in Figure 18.

INTVCC (F6): Internal 5.5V LDO for Driving the Control

CircuitryintheLTM4636.INTVCCiscontrolledandenabled

when RUNC is activated high. Tie to VIN, when 4.7V ≤ VIN

≤ 5.5V, minimum VIN = 4.2V.

FREQ (G5): A resistor can be applied from this pin to

ground to set the operating frequency. This pin sources

20µA. See the Applications Information section.

PHASMD (G7): This pin can be voltage programmed to

change the phase relationship of the CLKOUT pin with

reference to the internal clock or an input synchronized

clock. The INTVCC (5.5V) output can be voltage divided

down to the PHASMD pin to set the particular phase. The

Electrical Characteristics show the different settings to

select a particular phase. See the Applications Informa-

tion section.

RUNP (G8): This pin enables the PVCC supply. This pin

can be connected to VIN, or tie to ground when connecting

PVCC to VIN ≤ 5.5V. RUNP needs to sequence up before

RUNC. A 15k resistor from PVCC to RUNC with a 0.1µF

capacitor will provide enough delay. In parallel operation

with multiple LTM4636s, the resistor can be reduced in

value by N times and the 0.1µF can be increased N times.

SeeApplicationsInformationsection.RUNPcanbeusedto

settheminimumUVLOwithavoltagedivider.SeeFigure1.

NC (G9): No Connection.

PVCC (F9): 5V Power Output and Power for Internal Power

MOSFETDrivers.Theregulatorcanpower50mAofexternal

sourcing for additional use. Place a 22µF ceramic filter

capacitor on this pin to ground. When VIN < 5.5V, tie VIN

and PVCC together along with INTVCC. Then tie RUNP to

GND. If VIN > 5.5V then operate PVCC regulator as normal.

See the Typical Application examples.

TEMP+ (G12): Temperature Monitor. An internal diode

connected NPN transistor. See the Applications Informa-

tion section.

TEMP– (G11): Low Side of the Internal Temperature

Monitor.

CLKOUT (G3): Clock out signal that can be phase selected

to the main internal clock or synchronized clock using

the PHASMD pin. CLKOUT can be used for multiphase

applications. See the Applications Information section.

TEST1(H4),TEST2(F5),TEST3(H2),TEST4(E11),GMON

(H9):These are test pins used in the final production test

of the part. Leave floating.

VIN (H5-H6, J4-J7, K4-K8, L4-L8, M4-M8): Power Input

Pins. Apply input voltage between these pins and GND

pins. Recommend placing input decoupling capacitance

directly between VIN and GND pins.

PWM (H7): PWM output that drives the power stage.

Primarily used for test, but can be monitored in debug

or testing.

TMON(H8):TemperatureMonitorPin.Internaltemperature

monitor,variesfrom1Vat25°Cto1.44Vat150°C,disables

power stage at 150°C. If this feature is not desired, then

tie the TMON pin to GND.

SW (L11, K11): These are pin connections to the internal

switch node for test evaluation and monitoring. An R-C

snubber can be placed from the switch pins to GND to

eliminate any high frequency ringing. See the Applications

Information section.

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