SERIAL 2K（256×8）EEPROM

 

 

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AT24C02(C)

TSSOP8 PACKAGE

Units

INCHES^

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

MIN

NOM

MAX

Number of Pins

n

8

8

Pitch

P

0.026

0.65

Overall Height

A

0.043

1.10

Molded Package Thickness

A2

0.033

0.035

0.037

0.85

0.90

0.95

Standoff §

A1

0.002

0.004

0.006

0.05

0.10

0.15

Overall Width

E

0.246

0.251

0.256

6.25

6.38

6.50

Molded Package Width

E1

0.169

0.173

0.177

4.30

4.40

4.50

Molded Package Length

D

0.114

0.118

0.122

2.90

3.00

3.10

Foot Length

L

0.020

0.024

0.028

0.50

0.60

0.70

Foot Angle

Ø

0

4

8

0

4

8

Lead Thickness

C

0.004

0.006

0.008

0.009

0.15

0.20

Lead Width

B

0.007

0.010

0.012

0.19

0.25

0.30

Mold Draft Angle Top

a

0

5

10

0

5

10

Mold Draft Angle Bottom

ß

0

5

10

0

5

10

Controlling Parameter

§Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall

not exceed.005”(0.127mm) per side. JEDEC Equivalent:MO-153Drawing No. C04-086