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USB334X Datasheet(PDF) 84 Page - Microchip Technology

No. de pieza USB334X
Descripción Electrónicos  Enhanced Single Supply Hi-Speed USB ULPI Transceiver
PDF  92 Pages
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Fabricante Electrónico  MICROCHIP [Microchip Technology]
Página de inicio  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

USB334X Datasheet(HTML) 84 Page - Microchip Technology

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USB334x
DS00002646A-page 84
2009-2018 Microchip Technology Inc.
FIGURE 9-1:
24-Pin Sawn QFN - USB3341 Only (CONTINUED)
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
2.60
2.60
MILLIMETERS
0.50 BSC
MIN
E
MAX
3.90
Contact Pad Length (X24)
Contact Pad Width (X24)
Y1
X1
0.85
0.30
Microchip Technology Drawing C04-2143A MJ
NOM
24-Lead Very Thin Plastic Quad Flat, No Lead Package (MJ) – 4x4x0.9 mm Body [VQFN]
SILK SCREEN
1
2
24
C1
C2
E
X1
Y1
G1
Y2
X2
C1
Contact Pad Spacing
3.90
Contact Pad to Center Pad (X24)
G1
0.23
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.30
1.00
ØV
EV
EV
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
G2
Contact Pad to Contact Pad (X20)
G2
0.20



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