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ICS671-03 Datasheet(PDF) 4 Page - Integrated Circuit Systems

No. de pieza ICS671-03
Descripción Electrónicos  3.3 Volt Zero Delay, Low Skew Buffer
PDF  4 Pages
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Fabricante Electrónico  ICST [Integrated Circuit Systems]
Página de inicio  http://www.icst.com
Logo ICST - Integrated Circuit Systems

ICS671-03 Datasheet(HTML) 4 Page - Integrated Circuit Systems

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ICS671-03
3.3 Volt Zero Delay, Low Skew Buffer
MDS 671-03 A
4
Revision 072501
Integrated Circuit Systems, Inc. • 525 Race Street • San Jose • CA • 95126 • (408) 295-9800 tel • www.icst.com
PRELIMINARY INFORMATION
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems,
Incorporated (ICS) assumes no responsibility for either its use or for the infringement of any patents or other rights of third
parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in
normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or
other extraordinary environmental requirements are not recommended without additional processing by ICS. ICS reserves the
right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life
support devices or critical medical instruments.
Ordering Information
Part/Order Number
Marking
Shipping packaging
Package
Temperature
ICS671M-03I
ICS671M-03I
tubes
16 pin SOIC
-40 to +85 °C
ICS671M-03IT
ICS671M-03I
tape and reel
16 pin SOIC
-40 to +85 °C
16 pin SOIC narrow
Inches
Inches
Millimeters
Millimeters
Symbol
Min
Max
Min
Max
A
0.0532
0.0688
1.35
1.75
A1
0.0040
0.0098
0.10
0.24
B
0.0130
0.0200
0.33
0.51
C
0.0075
0.0098
0.19
0.24
D
0.3859
0.3937
9.80
10.00
E
0.1497
0.1574
3.80
4.00
e
.050 BSC
.050 BSC
1.27 BSC
1.27 BSC
H
0.2284
0.2440
5.80
6.20
h
0.0099
0.0195
0.25
0.50
L
0.0160
0.0500
0.41
1.27
B
D
E
H
e
A1
C
A
h x 45°
L
INDEX
AREA
1
2
Package Outline and Package Dimensions
(For current dimensional specifications, see JEDEC Publication No. 95.)



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