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ADP2165ACPZ-1.0-R7 Datasheet(PDF) 6 Page - Analog Devices |
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ADP2165ACPZ-1.0-R7 Datasheet(HTML) 6 Page - Analog Devices |
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6 / 23 page ![]() ADP2165/ADP2166 Data Sheet Rev. B | Page 6 of 23 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating PVIN, AVIN, EN, PGOOD, FB −0.3 V to +6 V SW −1 V to +6 V BST SW + 6 V SS, COMP, TRK, VREG, SYNC, RT −0.3 V to +6 V PGND to GND −0.3 V to +0.3 V Operating Junction Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C Soldering Conditions JEDEC J-STD-020 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board (4-layer, JEDEC standard board) for surface-mount packages. Table 3. Thermal Resistance Package Type θJA Unit 24-Lead LFCSP 38.3 °C/W ESD CAUTION |
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