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2022 Microchip Technology Inc. and its subsidiaries

DS20006678A-page 17

MIC5321

6-Lead 1.6 mm x 1.6 mm WDFN Package Outline and Recommended Land Pattern

B

A

0.05 C

0.05 C

0.07

C A B

0.05

C

C

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

0.10

C A B

0.10

C A B

0.05 C

0.08 C

2X

6X

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

6-Lead Very, Very Thin Dual Flat, No Lead Package (K3A) - 1.6x1.6x0.8 mm Body [WDFN]

With 1.26x0.5 mm Exposed Pad; Micrel Legacy Package Code DFN1616-6LD-PL-1

Sheet 1 of 2

Microchip Technology Drawing C04-1015 Rev A

NOTE 1

SEATING

PLANE

(DATUM A)

(DATUM B)

NOTE 1

D

E

(A3)

A

A1

D2

E2

6X b

e

12

N

N

2

1

K

R0.10

L