[2SMPB-02E] Datasheet Rev.05(Jun.,2017)

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Copyright 2017 OMRON Corporation. All Rights Reserved.

6. Recommended Soldering Method

■ Soldering method

: Air Reflow ( Max 2 times )

■ Condition of Temperature

: Max.260 degreeC, within 40seconds

■ Recommended Soldering Method

:

Temperature profile conditions of

reflow soldering should set the tem-

perature condition as shown in the

below table and then confirm that

actual conditions are met them in the

table.

Item

Preheating (T1 to T2, t1)

Soldering (T3, t2)

Peak Value (T4)

Terminal

150 degreeC to 200 degreeC

60sec to 180sec.

217degreeC min.

60sec to 150sec.

260 degreeC

20sec to 40sec..

・

Since the pressure sensor chip is exposed to atmosphere, cleaning fluid shall not be allowed to enter

inside the sensor’s case.

・

We recommend that it should be used the recommended mounting PAD dimensions for the land pattern.

7. Precautions

(1) Handling

1)

Only air can be used as pressure media on the product directly. It is prohibited to use pressure media including corrosive

gases (e.g. organic solvents gases, sulfur dioxide and hydrogen sulfide gases), fluid and any other foreign materials.

2)

The products are not water proof. The product shall be kept dry in use excluding the sensor port.

3)

The product shall not be used under dew-condensing conditions. Frozen fluid on sensor chips may cause fluctuation of sen-

sor output and other troubles.

4)

The product shall be used within rated pressure. Usage at pressure out of the range may cause breakage.

5)

The product may be damaged by static electricity. Charged materials (e.g. a workbench and a floor) and workers should pro-

vide measures against static electricity, including ground connection.

6)

The product shall not be dropped and handled roughly.

7)

The product shall not be used under dusty or damp condition.

8)

Do not wash the print circuit board after the pressure sensor is mounted using solvent. It may cause a mal-

function.

9)

Please connect the sensor terminals according to the connection diagram.

10)

The product shall not be used under high-frequency vibration including ultrasonic wave.

11)

This product uses the elastic adhesive for bonding the lid, so do not add excessive stress to the lid.

12)

If soldering is not fit, then this product may catch fire or get hot.

13)

There is a possibility that the peripheral circuit board or some electronic part generates heat while driving this

product. Please handle with care.

14)

Do not tear down this product.

15)

Please do not use the sensor after following case;

- excessive shock added to the terminal of the sensor

- the sensor lid decapped

- the sensor dropped

16)

If you use other conditions described in this document, please check yourself in advance.

t1

Preheating

t2

Soldering

Time (s)

T1

T2

T3

T4

t1

Preheating

t2

Soldering

Time (s)

T1

T2

T3

T4