HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HD200204

Issued Date : 2002.04.01

Revised Date : 2005.08.18

Page No. : 3/4

HTIP117D

HSMC Product Specification

TO-126ML Dimension

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454

• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

Tel: 886-3-5983621~5 Fax: 886-3-5982931

D

I

E

B

G

F

A

N

C

H

3

2

1

M

J

K

L

3-Lead TO-126ML

Plastic Package

HSMC Package Code: D

Marking:

Control Code

Date Code

HP

11 7

Pb Free Mark

Pb-Free: "

Normal: None

I

D

T

Note: Green label is used for pb-free packing

Pin Style: 1.Emitter 2.Collector 3.Base

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

DIM

Min.

Max.

A

7.74

8.24

B

10.87

11.37

C

0.88

1.12

D

1.28

1.52

E

3.50

3.75

F

2.61

3.37

G13

-

H

1.18

1.42

I

2.88

3.12

J

0.68

0.84

K

-

2.30

L

3.44

3.70

M

1.88

2.14

N

0.50

0.51

*: Typical, Unit: mm