M24C01-R datasheet(26/41 Pages) STMICROELECTRONICS

No. de pieza	M24C01-R

Descripción Electrónicos	1-Kbit and 2-Kbit serial I²C bus EEPROMs

PDF	41 Pages

Scroll/Zoom	100%

Fabricante Electrónico	STMICROELECTRONICS [STMicroelectronics]

Página de inicio	http://www.st.com

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26 / 41 page

Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,

depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product

status are available at: www.st.com.

ECOPACK is an ST trademark.

9.1

UFDFPN5 (DFN5) package information

UFDFPN5 is a 5-lead, 1.7 × 1.4 mm, 0.55 mm thickness, ultra thin fine pitch dual flat package.

Figure 13. UFDFPN5 - Outline

Top view

(marking side)

Side view

Bottom view

(pads side)

Pin 1

Package UFDFN5 (package code A0UK)

A0UK_UFDFN5_ME_V3

Maximum package warpage is 0.05 mm.

Exposed copper is not systematic and can appear partially or totally according to the cross section.

Drawing is not to scale.

On the bottom side, pin 1 is identified by the specific pad shape and, on the top side, pin 1 is defined from

the orientation of the marking. When reading the marking, pin 1 is below the upper left package corner.

M24C01/02-W M24C01/02-R M24C02-F

Package information

DS9398 - Rev 7

page 26/41

M24C01-R Datasheet(PDF) 26 Page - STMicroelectronics