MPC8560 datasheet(95/108 Pages) FREESCALE

95 / 108 page

MPC8560 Integrated Processor Hardware Specifications, Rev. 3.1

Freescale Semiconductor

Thermal

Figure 57. Exploded Views (2) of a Heat Sink Attachment using a Plastic Force

The die junction-to-ambient and the heat sink-to-ambient thermal resistances are common figure-of-merits used for

comparing the thermal performance of various microelectronic packaging technologies, one should exercise caution

when only using this metric in determining thermal management because no single parameter can adequately

describe three-dimensional heat flow. The final die-junction operating temperature is not only a function of the

component-level thermal resistance, but the system level design and its operating conditions. In addition to the

component’s power consumption, a number of factors affect the final operating die-junction temperature: airflow,

board population (local heat flux of adjacent components), system air temperature rise, altitude, etc.

Due to the complexity and the many variations of system-level boundary conditions for today’s microelectronic

equipment, the combined effects of the heat transfer mechanisms (radiation convection and conduction) may vary

widely. For these reasons, we recommend using conjugate heat transfer models for the boards, as well as,

system-level designs.

MPC8560 Datasheet(PDF) 95 Page - Freescale Semiconductor, Inc