AS7261 datasheet(39/48 Pages) OSRAM

No. de pieza	AS7261

Descripción Electrónicos	XYZ Chromatic White Color Sensor NIR with Electronic Shutter and Smart Interface

PDF	48 Pages

Scroll/Zoom	100%

Fabricante Electrónico	OSRAM [OSRAM GmbH]

Página de inicio	http://www.osram.com

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39 / 48 page

Page 38

ams Datasheet

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[v1-00] 2016-Dec-30

AS7261 − Soldering & Storage Information

Soldering Information

The module has been tested and has demonstrated an ability

to be reflow soldered to a PCB substrate. The solder reflow

profile describes the expected maximum heat exposure of

components during the solder reflow process of product on a

PCB. Temperature is measured on top of component. The

components should be limited to a maximum of three passes

through this solder reflow profile.

Figure 38:

Solder Reflow Profile

Figure 39:

Solder Reflow Profile Graph

Parameter

Reference

Device

Average temperature gradient in preheating

2.5 ºC/s

Soak time

tsoak

2 to 3 minutes

Time above 217°C (T1)t1

Max 60 s

Time above 230°C (T2)t2

Max 50 s

Time above Tpeak - 10ºC (T3)t3

Max 10 s

Peak temperature in reflow

Tpeak

260 ºC

Temperature gradient in cooling

Max -5 ºC/s

Soldering & Storage

Information

tsoak

Tpeak

Not to scale — for reference only

Time (s)

AS7261 Datasheet(PDF) 39 Page - OSRAM GmbH

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