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AS73211 Datasheet(PDF) 61 Page - OSRAM GmbH

No. de pieza AS73211
Descripción Electrónicos  XYZ True Color Sensor with I²C Interface
PDF  66 Pages
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Fabricante Electrónico  OSRAM [OSRAM GmbH]
Página de inicio  http://www.osram.com
Logo OSRAM - OSRAM GmbH

AS73211 Datasheet(HTML) 61 Page - OSRAM GmbH

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AS73211
Soldering & Storage Information
Datasheet
• PUBLIC
DS000556
• v3-01 • 2018-Feb-07
65
│ 60
12
Soldering & Storage Information
The die-attach pad 17 (exposed pad) of the QFN16 package must be connected to analog ground
VSSA on PCB. Realize this before soldering by a conductive adhesive and bonding this pad of the
sensor backside to a ground pad on the PCB.
According to the JEDEC standard, the QFN16 package has been tested and has demonstrated the
ability to be reflow-soldered to a PCB substrate. The solder reflow profile describes the expected
maximum heat exposure of components during the solder reflow process of product on a PCB.
Temperature is measured on top of component. The component should be limited to a maximum of
three passes through this solder reflow profile.
Figure 60:
Profile Features According to JEDEC
IPC/JEDEC J-STD-020D.1
(Pb-Free)
RECOMMENDED DATA
Time [s] from 150°C to 200°C (preheat)
60
– 120
100
Average ramp-up rate [°C/s]
(200°C to peak temperature)
maximum 3.0
0.5
– 1.0
Liquidus temperature [°C]
Time [s] above liquidus (217°C)
217
60
– 150
217
110
Peak package body temperature [°C]
maximum 260
≤ 260
Time [s] within 5°C of the classification
temperature
minimum 30
35
– 45
Average ramp-down rate [°C/s] (peak
temperature to 200°C)
maximum 6.0
3.0
Time [s] from 25°C to peak temperature
maximum 480
350
Do not exceed the recommended values shown in the table or following figure. For further information,
see the JEDEC standard J-STD-020D.1.
Figure 61:
Solder Reflow Profile Graph
Time 25 °C To Peak
tS
Time →
TL
TP
25
Tsmin
Tsmax
tL
Preheat Area
Max. Ramp Up Rate = 3 °C/s
Max. Ramp Down Rate = 6 °C/s
tP
TC –5 °C
Supplier tP
Supplier TP ≥ TC
User tP
User TP ≤ TC
TC
TC –5 °C



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