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M24M02E-F Datasheet(PDF) 40 Page - STMicroelectronics

No. de pieza M24M02E-F
Descripción Electrónicos  2-Mbit serial I²C bus EEPROM with configurable device address, software write protection registers, and preprogrammed device address
PDF  54 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M24M02E-F Datasheet(HTML) 40 Page - STMicroelectronics

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10.2
TSSOP8 package information
This TSSOP is an 8-lead, 3 x 6.4 mm, 0.65 mm pitch, thin shrink small outline package.
Figure 30. TSSOP8 – Outline
1
c
L
E
D
k
e
4
L1
E1
A2
b
8
5
A1
aaa C
A1
A
D
E1
e
Pin 1 identification
C
Seating
plane
1. Drawing is not to scale.
Table 22. TSSOP8 - Mechanical data
Symbol
millimeters
inches (1)
Min.
Typ.
Max.
Min.
Typ.
Max.
A
-
-
1.200
-
-
0.0472
A1
0.050
-
0.150
0.0020
-
0.0059
A2
0.800
1.000
1.050
0.0315
0.0394
0.0413
b
0.190
-
0.300
0.0075
-
0.0118
c
0.090
-
0.200
0.0035
-
0.0079
D(2)
2.900
3.000
3.100
0.1142
0.1181
0.1220
e
-
0.650
-
-
0.0256
-
E
6.200
6.400
6.600
0.2441
0.2520
0.2598
E1(3)
4.300
4.400
4.500
0.1693
0.1732
0.1772
L
0.450
0.600
0.750
0.0177
0.0236
0.0295
L1
-
1.000
-
-
0.0394
-
k
0°
-
8°
0°
-
8°
aaa
-
-
0.100
-
-
0.0039
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed
0.15 mm per side.
3. Dimension E1 does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25 mm per
side.
M24M02E-F
Package information
DS14157 - Rev 2
page 40/54



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