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PACKAGE OUTLINE

C

32X

0.25

0.15

2.8 0.05

32X

0.45

0.25

1 MAX

(0.2) TYP

0.05

0.00

28X 0.4

2X

2.8

2X 2.8

A

4.1

3.9

B

4.1

3.9

0.25

0.15

0.45

0.25

4X (0.45)

(0.1)

VQFN - 1 mm max height

RSM0032B

PLASTIC QUAD FLATPACK - NO LEAD

4219108/B 08/2019

PIN 1 INDEX AREA

0.08 C

SEATING PLANE

1

8

17

24

9

16

32

25

(OPTIONAL)

PIN 1 ID

0.1

C A B

0.05

EXPOSED

THERMAL PAD

DETAIL

SEE TERMINAL

SYMM

SYMM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

33

SEE SIDE WALL

DETAIL

SIDE WALL DETAIL

OPTIONAL METAL THICKNESS

SCALE 3.000

DETAIL

OPTIONAL TERMINAL

TYPICAL