Standard Materials

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Standard RoHS and green material sets available

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Package substrate

▷ Conductor: Copper

▷ Dielectric: Thin core FR5 or equivalent

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Die attach adhesive: Conductive or non-conductive

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Encapsulant: Epoxy mold compound

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Solder ball: Pb-free

Reliability Qualification

Amkor assures reliable performance by continuously monitoring key indices.

Package Level

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Moisture resistance testing: JEDEC level 3 @ 260°C x 3 reflows

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Additional test data: 30°C, 85% RH, 96 hours @ 260°C x 4

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uHAST: 130°C, 85% RH, 96 hours

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Temp/Humidity: 85°C, 85% RH, 1000 hours

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Temp cycle: -55°C/+125°C, 1000 cycles

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High temp storage: 150°C, 1000 hours

Board Level

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Thermal cycle: -40°C/+125°C, 1000 cycles

Package Dimensions

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PSvfBGA: 10 x 10 mm to 15 x 15 mm

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PSfcCSP: 12 x 12 mm to 13 x 13 mm

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TMV® PoP: 12 x 12 mm to 14 x 14 mm

Shipping

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JEDEC trays

Features

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10-15 mm body sizes tooled per product table,

additional sizes based on demand

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Top package I/O interface 0.65 mm pitch

accommodating 104 to 160 pin counts

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Wafer thinning/handling <100 μm

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Mature PoP platform with consistent product

performance and reliability

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Package configurations compliant with JEDEC

standards

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Bottom PSvfBGA and top FBGA/Stacked CSP

packages are well established in high volume

production with multi-region and factory support

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Stacked package heights of 1.3 mm to 1.5 mm

available in a variety of configurations (See Stack Up

Tables on following pages)

Process Highlights

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Die thickness: 75 μm to 125 μm

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Bond pad pitch (min): 45 μm (in-line)

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Marking: Laser

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Wafer thinning: 200 & 300 mm wafers

Test Services

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Program generation/conversion

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Product engineering

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Dual sided contactor system available

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Tape and reel services