HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HE6464

Issued Date : 1993.09.07

Revised Date : 2005.02.15

Page No. : 3/4

HT666

HSMC Product Specification

TO-92 Dimension

TO-92 Taping Dimension

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454

• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

Tel: 886-3-5983621~5 Fax: 886-3-5982931

3

1

A

D

B

C

I

E

G

H

2

F

H2A

H2A

H2

H2

D2

A

H

W

W1

H3

H4

H1

L1

L

P2

P

P1

F1F2

D1

D

T2

T

T1

DIM

Min.

Max.

A

4.33

4.83

B

4.33

4.83

C

12.70

-

D

0.36

0.56

E-

*1.27

F

3.36

3.76

G

0.36

0.56

H-

*2.54

I-

*1.27

α1

-

*5

°

α2

-

*2

°

α3

-

*2

°

*: Typical, Unit: mm

3-Lead TO-92 Plastic Package

HSMC Package Code: A

DIM

Min.

Max.

A

4.33

4.83

D

3.80

4.20

D1

0.36

0.53

D2

4.33

4.83

F1,F2

2.40

2.90

H

15.50

16.50

H1

8.50

9.50

H2

-

1

H2A

-

1

H3

-

27

H4

-

21

L-

11

L1

2.50

-

P

12.50

12.90

P1

5.95

6.75

P2

50.30

51.30

T

-

0.55

T1

-

1.42

T2

0.36

0.68

W

17.50

19.00

W1

5.00

7.00

Unit: mm

Marking:

Pb Free Mark

Pb-Free: "

Normal: None

Control Code

Date Code

HT

66 6

Note: Green label is used for pb-free packing

Pin Style: 1.Emitter 2.Collector 3.Base

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0